research on electronic components

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Electrical and electronic engineering is the branch of engineering that makes use of electricity. Electrical engineering concentrates on systems for generating and transmitting large electrical currents and converting them into other forms of energy, such as mechanical motion. Electronic engineering focusses on lower energy currents for processing and communicating information.

Wireless radiofrequency network of distributed microsensors

Distributed sensing of a dynamic environment is typically characterized by the sparsity of events, such as neuronal firing in the brain. Using the brain as inspiration, an event-driven communication strategy is developed that enables the efficient transmission, accurate retrieval and interpretation of sparse events across a network of thousands of wireless microsensors.

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Electronic Components Research

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Filter Reports

By Countries

56 Electronic Components Reports

Study Period: 2019 - 2029

Regions Covered: North America, Europe, Asia-Pacific, Latin America, Middle East and Africa

Major Players: TE Connectivity, American Zettler, Churod Electronics, Omron, Panasonic

Major Players: Molex LLC, TE Connectivity Ltd, Amphenol Corporation, 3M Company, Samtec Inc.

Major Players: 3M Company, Molex Inc. (Koch), TE Connectivity Limited, Amphenol Corporation, Samtec Inc.

Major Players: ABB Ltd, Emerson Electric Co., Endress+Hauser AG, Siemens AG, Vega Grieshaber KG

Countries Covered: China, Japan, South Korea, Australia

Major Players: ABB Ltd , Schneider Electric SE , Cummins Inc. , Generac Power Systems Inc.​ , Siemens AG​

Regions Covered: North America, Europe, Asia Pacific, Latin America, Middle East and Africa

Major Players: ABB Ltd., Schneider Electric SE , Mitsubishi Electric Corporation, Siemens AG, Bender GmbH & Co. KgG

Major Players: ABB Ltd, Schneider Electric SE, Rockwell Automation, Inc., Simens AG, Eaton

Countries Covered: United States, Canada

Major Players: ABB Ltd., Schneider Electric SE, Schweitzer Engineering Laboratories, Woodward Inc., Eaton Corporation

Regions Covered: North America, Europe, Latin America, Middle East and Africa

Major Players: Advantest Corporation, Alpes Lasers S.A., Applied Research And Photonics Inc., ARA Scientific, Emcore Corp.

Major Players: American Connectors Inc., Thomas & Betts ( ABB Group), ITT BIW Connector Systems, Emerson Industrial Automation, Amphenol Industrial Products Group

Major Players: American Connectors Inc., Amphenol Industrial Products Group, Thomas & Betts, Texcan, Hubbell-Killark

Major Players: Amphenol Corporation, TE Connectivity Limited, Fujitsu Limited, Huawei Technologies Co. Ltd., Axon Cable S.A.S

Regions Covered: North America, Europe, Asia-Pacific

Major Players: Amphenol Corporation, TE Connectivity Ltd., Eaton Corporation, Smiths Group PLC, Carlisle Companies Inc.

Regions Covered: North America, Europe, Asia Pacific

Major Players: Analog Devices Inc., Renesas Electronics Corporation, Microchip Technology Inc., Texas Instruments Inc., Maxim Integrated

Regions Covered: North America, Europe

Major Players: Blue Spark Technologies, Inc., Enfucell OY Ltd., Brightvolt Inc., Cymbet Corporation, Inc., Imprint Energy, Inc.

Regions Covered: North America, Europe, Asia-Pacific, Middle East and Africa

Major Players: NXP Semiconductors N.V, Texas Instruments Incorporated, STMicroelectronics N.V., Mitsubishi Electric Corporation, Toshiba Corporation

Major Players: Diodes Incorporated, Infineon Technologies AG, ROHM Co. Ltd, NXP Semiconductors NV, Vishay Inter technology Inc.

Study Period: 2019-2029

Regions Covered: Americas, Middle East and Africa, Asia Pacific, North America, Europe

Major Players: Delta Electronics Inc. , Panasonic Corporation, TDK Corporation, Vishay Intertechnology Inc., Murata Manufacturing Co. Ltd

Major Players: Diodes Incorporated, Microsemi Corporation, On Semiconductor Corporation, Vishay Intertechnology, Inc, ROHM Co., Ltd.

Regions Covered: North America

Major Players: Eaton Corporation Plc., ABB Ltd., TDK Electronics AG, Siemens AG, General Atomics Inc.

Major Players: Eaton Corporation Inc, Alstom SA, G&W Electric Company, ABB Ltd, General Electric Company

Regions Covered: Europe

Major Players: Eaton Corporation PLC, Skeleton Technologies Inc., Cap-XX Limited, Maxwell Technologies Inc. (Tesla Inc.)​, Kyocera Corporation

Major Players: Eaton Corporation PLC, Maxwell Technologies Inc. (Tesla Inc.), Skeleton Technologies Inc., Cap-XX Limited, Kyocera Corporation

Major Players: Infineon Technologies AG, NXP Semiconductors NV, Texas Instruments, Inc., Panasonic Corporation, Murata Manufacturing Co. Ltd

Major Players: Infineon Technologies AG, Renesas Electronics Corporation, NXP Semiconductors N.V, ST Microelectronics, Microchip Technology Inc.

Major Players: Infineon Technologies AG, Renesas Electronics Corporation​, Texas Instruments Incorporated, Analog Devices Inc.​, Microchip Technology Inc.

Major Players: Analog Devices, Texas Instruments Inc, Broadcom Inc., Microchip Technology Inc, NXP Semiconductors

Study Period: 2017 - 2029

Regions Covered: Asia-Pacific, Europe, North America

Major Players: Murata Manufacturing Co., Ltd, Samsung Electro-Mechanics, Taiyo Yuden Co., Ltd, TDK Corporation, Yageo Corporation

Major Players: Microchip Technology Inc., Infineon Technologies AG, Vishay Intertechnology, Inc., Renesas Electronics Corporation, NXP Semiconductors

Major Players: Miyazaki Epson Corporation, Nihon Dempa Kogyo (NDK) Co. Ltd, Oscilloquartz (ADVA), Murata Manufacturing, Daishinku Corp. (KDS)

• Asia Electronic Components Research
• Europe Electronic Components Research
• Latin America Electronic Components Research
• Middle East and Africa Electronic Components Research
• North America Electronic Components Research
• Canada Electronic Components Research
• China Electronic Components Research
• Japan Electronic Components Research
• US Electronic Components Research

Related Electronic Components Reports

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3D-printing and advanced manufacturing for electronics

• Review Article
• Published: 04 February 2019
• Volume 4 , pages 245–267, ( 2019 )

Cite this article

• Alejandro H. Espera Jr.   ORCID: orcid.org/0000-0002-3294-1847 1 , 2 ,
• John Ryan C. Dizon 1 , 3 ,
• Qiyi Chen 1 &
• Rigoberto C. Advincula 1  

7009 Accesses

193 Citations

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Printed electronics currently holds a significant share in the electronics fabrication market due to advantages in high-throughput production and customizability in terms of material support and system process. The printing of traces and interconnects, passive and active components such as resistors, capacitors, inductors, and application-specific electronic devices, have been a growing focus of research in the area of additive manufacturing. Adaptation of new 3D-printing technologies and manufacturing methods, specifically for printed electronics, are potentially transformative in flexible electronics, wireless communications, efficient batteries, solid-state display technologies, etc. Other than printing new and reactive functional electronic materials, the functionalization of the printing substrates with unusual geometries apart from the conventional planar circuit boards will be a challenge. Building the substrate, printing the conductive tracks, pick-and-placing or embedding the electronic components, and interconnecting them, are fundamental fabrication protocols new 3D-printing systems should adopt for a more integrated fabrication. Moreover, designers and manufacturers of such systems will play an important role in scaling 3D-printed electronics from prototyping to high-throughput mass production. This review gives a groundwork for such understanding, defining methods and protocols, reviewing various 3D-printing methods, and describing the state-of-the-art in 3D-printed electronics and their future growth.

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A Review on Printed Electronics with Digital 3D Printing: Fabrication Techniques, Materials, Challenges and Future Opportunities

3D Printing: Printed Electronics

Recent advances in direct ink writing of electronic components and functional devices

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Acknowledgements

We would like to thank the Case Western Reserve University through PETRO Case, Honeywell—Kansas City National Security Campus (KCNSC) and the Department of Science and Technology—Philippine Council for Industry, Energy, and Emerging Technology Research and Development (DOST-PCIEERD) for resources and funding in the area of additive manufacturing.

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Espera, A.H., Dizon, J.R.C., Chen, Q. et al. 3D-printing and advanced manufacturing for electronics. Prog Addit Manuf 4 , 245–267 (2019). https://doi.org/10.1007/s40964-019-00077-7

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Received : 19 July 2018

Accepted : 28 January 2019

Published : 04 February 2019

Issue Date : 01 September 2019

DOI : https://doi.org/10.1007/s40964-019-00077-7

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New circuit boards can be repeatedly recycled

A recent United Nations report found that the world generated 137 billion pounds of electronic waste in 2022, an 82% increase from 2010. Yet less than a quarter of 2022's e-waste was recycled. While many things impede a sustainable afterlife for electronics, one is that we don't have systems at scale to recycle the printed circuit boards (PCBs) found in nearly all electronic devices.

PCBs -- which house and interconnect chips, transistors and other components -- typically consist of layers of thin glass fiber sheets coated in hard plastic and laminated together with copper. That plastic can't easily be separated from the glass, so PCBs often pile up in landfills, where their chemicals can seep into the environment. Or they're burned to extract their electronics' valuable metals like gold and copper. This burning, often undertaken in developing nations, is wasteful and can be toxic -- especially for those doing the work without proper protections.

A team led by researchers at the University of Washington developed a new PCB that performs on par with traditional materials and can be recycled repeatedly with negligible material loss. Researchers used a solvent that transforms a type of vitrimer -- a cutting-edge class of sustainable polymers -- to a jelly-like substance without damaging it, allowing the solid components to be plucked out for reuse or recycling.

The vitrimer jelly can then be repeatedly used to make new, high-quality PCBs, unlike conventional plastics that degrade significantly with each recycling. With these "vPCBs" (vitrimer printed circuit boards), researchers recovered 98% of the vitrimer and 100% of the glass fiber, as well as 91% of the solvent used for recycling.

The researchers published their findings April 26 in Nature Sustainability.

"PCBs make up a pretty large fraction of the mass and volume of electronic waste," said co-senior author Vikram Iyer, a UW assistant professor in the Paul G. Allen School of Computer Science & Engineering. "They're constructed to be fireproof and chemical-proof, which is great in terms of making them very robust. But that also makes them basically impossible to recycle. Here, we created a new material formulation that has the electrical properties comparable to conventional PCBs as well as a process to recycle them repeatedly."

Vitrimers are a class of polymers first developed in 2015. When exposed to certain conditions, such as heat above a specific temperature, their molecules can rearrange and form new bonds. This makes them both "healable" (a bent PCB could be straightened, for instance) and highly recyclable.

"On a molecular level, polymers are kind of like spaghetti noodles, which wrap and get compacted," said co-senior author Aniruddh Vashisth, a UW assistant professor in the mechanical engineering department. "But vitrimers are distinct because the molecules that make up each noodle can unlink and relink. It's almost like each piece of spaghetti is made of small Legos."

The team's process to create the vPCB deviated only slightly from those used for PCBs. Conventionally, semi-cured PCB layers are held in cool, dry conditions where they have a limited shelf life before they're laminated in a heat press. Because vitrimers can form new bonds, researchers laminated fully cured vPCB layers. The researchers found that to recycle the vPCBs they could immerse the material in an organic solvent that has a relatively low boiling point. This swelled the vPCB's plastic without damaging the glass sheets and electronic components, letting the researchers extract these for reuse.

This process allows for several paths to more sustainable, circular PCB lifecycles. Damaged circuit boards, such those with cracks or warping, can in some cases be repaired. If they aren't repaired, they can be separated from their electronic components. Those components can then be recycled or reused, while the vitrimer and glass fibers can get recycled into new vPCBs.

The team tested its vPCB for strength and electrical properties, and found that it performed comparable to the most common PCB material (FR-4). Vashisth and co-author Bichlien H. Nguyen, a principal researcher at Microsoft Research and an affiliate assistant professor in the Allen School, are now using artificial intelligence to explore new vitrimer formulations for different uses.

Producing vPCBs wouldn't entail major changes to manufacturing processes.

"The nice thing is that a lot of industries -- such as aerospace, automotive and even electronics -- already have processing set up for the sorts of two-part epoxies that we use here," said lead author Zhihan Zhang, a UW doctoral student in the Allen School.

The team analyzed the environmental impact and found recycled vPCBs could entail a 48% reduction in global warming potential and an 81% reduction in carcinogenic emissions compared to traditional PCBs. While this work presents a technology solution, the team notes that a significant hurdle to recycling vPCBs at scale would be creating systems and incentives to gather e-waste so it can be recycled.

"For real implementation of these systems, there needs to be cost parity and strong governmental regulations in place," said Nguyen. "Moving forward, we need to design and optimize materials with sustainability metrics as a first principle."

Additional co-authors include Agni K. Biswal, a UW postdoctoral scholar in the mechanical engineering department; Ankush Nandi, a UW doctoral student in the mechanical engineering department; Kali Frost, a senior applied scientist at Microsoft Research; Jake A. Smith, a senior researcher at Microsoft Research and an affiliate researcher in the Allen School; and Shwetak Patel, a UW professor in the Allen School and the electrical and computer engineering department. This research is funded by the Microsoft Climate Research Initiative, an Amazon Research Award and the Google Research Scholar Program. Zhang was supported by the UW Clean Energy Institute Graduate Fellowship.

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Materials provided by University of Washington . Original written by Stefan Milne. Note: Content may be edited for style and length.

Journal Reference :

• Zhihan Zhang, Agni K. Biswal, Ankush Nandi, Kali Frost, Jake A. Smith, Bichlien H. Nguyen, Shwetak Patel, Aniruddh Vashisth, Vikram Iyer. Recyclable vitrimer-based printed circuit boards for sustainable electronics . Nature Sustainability , 2024; DOI: 10.1038/s41893-024-01333-7

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Global Electronic Components Market - Industry Trends and Forecast to 2031

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Global Electronic Components Market, By Component Type (Processors, Motors, Battery, Microcontroller, Integrated Circuits, Circuit Breakers, Transformer, Capacitors, Diodes, Resistors, Inductors, Relays, Switches, Fuse), Commodities Type (Brown Goods, White Goods, Small White Goods), Product Type (Active, Passive, Electromechanical Components), End Use Type (Consumer Electronics, Networking & Telecommunication, Automotive, Manufacturing, Aerospace & Defense, Healthcare) - Industry Trends and Forecast to 2031.

Electronic Components Market Analysis and Size

Electronic components are fundamental building blocks of electronic devices and systems. These components include resistors, capacitors, diodes, transistors, integrated circuits, and various other electrical parts. They perform specific functions such as regulating current, storing charge, amplifying signals, and processing data. Electronic components are essential for the functioning of all electronic devices, from smartphones and computers to industrial machinery and automotive systems. They are key elements in the field of electronics, enabling the creation of intricate circuits and electronic products. Electronic components have a wide range of applications in every field related to electronic systems. Being a vital part of electronic systems, this market has great potential to grow at a higher rate in the future.

Data Bridge Market Research analyzes that the global electronic components market was valued at USD 484,625.45 million in 2023 and is expected to reach USD 700,061.60 million by 2031, registering a CAGR of 8.5% during the forecast period of 2023-2030. The active components segment in the product type is expected to grow with the highest growth rate due to the increased use of active semiconductor components such as microprocessors, microcontrollers , and ICs in most electronic devices. In addition to the insights on market scenarios such as market value, growth rate, segmentation, geographical coverage, and major players, the market reports curated by the Data Bridge Market Research also include in-depth expert analysis, geographically represented company-wise production and capacity, network layouts of distributors and partners, detailed and updated price trend analysis and deficit analysis of supply chain and demand.

Electronic Components Market Scope and Segmentation

Market Definition

Electronic components are the basic building blocks of electronic circuits or electronic systems. They control the flow of electrons throughout the circuit. They consist of two or more terminals to connect with one another. These components are connected together in an electronic board, such as a printed circuit board, to form the electronic circuit. Active, passive, and electromechanical are three major types of electronic components. Active components are those which possess the gain and can amplify or energize the electric signal. On the other hand, passive components do not possess gain and cannot amplify or energize the electric signal, they can only attenuate it. Electromechanical components convert the electrical signal into mechanical to cause some kind of change.

Global Electronic Components Market Dynamics

• Increasing Demand for IoT Devices

The growing adoption of Internet of Things (IoT) technology in various industries, such as healthcare, automotive, and smart homes , is driving the demand for electronic components. IoT devices require sensors , microcontrollers, and connectivity components, boosting the electronic components market.

• Advancements in Automotive Electronics

The automotive industry is undergoing a transformation with the development of electric vehicles (EVs), autonomous driving, and advanced infotainment systems. These innovations rely heavily on electronic components like power semiconductors and sensors, creating a significant market driver.

Opportunities

• 5G Technology Expansion

The rollout of 5G networks is creating new opportunities for electronic components. 5G technology demands a robust infrastructure, including RF components, antennas, and high-frequency semiconductors. As 5G adoption continues, the market for these components is expected to expand.

• Green and Sustainable Electronics

There is a growing emphasis on sustainability and environmentally friendly products. Electronic component manufacturers have the opportunity to develop eco-friendly components, such as energy-efficient semiconductors and recyclable materials, to meet the increasing demand for green electronics.

Restraints/Challenges

• Supply Chain Disruptions

The electronic components market is susceptible to supply chain disruptions, such as the shortage of critical materials, geopolitical tensions, and natural disasters. These disruptions can lead to delays in production and increased costs for manufacturers.

• Intellectual Property Concerns

Intellectual property (IP) theft and counterfeiting of electronic components are ongoing challenges. Protecting valuable IP and ensuring the authenticity of components is essential to maintain the trust of customers and prevent potential security risks in various applications.

Recent Development s

• In March 2020, Infineon Technologies AG has announced a new collaboration with Qualcomm to enable high-quality standard solution for 3D authentication. Infineon is thus extending its application portfolio of its 3D sensor technology for mobile devices. The reference design uses the REAL3 3D Time-of-Flight (ToF) sensor and enables a standardized, cost-effective and easy-to-design integration for smartphone manufacturers
• In October 2020, Volkswagen has adopted NXP battery management solutions for its MEB electrical vehicle platform. The collaboration with Volkswagen centred on the electronics for electric vehicles (EVs). Volkswagen has adopted NXP’s battery management system (BMS) into its innovative MEB platform to help increase vehicle range, extend battery longevity, and enhance safety

Global Electronic Components Market Scope

The electronic components market is segmented on the basis of the components type, commodities type, product type and end use type. The growth amongst these segments will help you analyze meagre growth segments in the industries and provide the Users with a valuable market overview and market insights to help them make strategic decisions for identifying core market applications.

Component Type

• Microcontroller
• Integrated Circuits
• Circuit Breakers
• Transformer

Commodities Type

• Brown Goods
• White Goods
• Small White Goods

Product Type

• Electromechanical Components

End Use Type

• Consumer Electronics
• Networking & Telecommunication
• Manufacturing
• Aerospace & Defense

Global Electronic Components Market Country Analysis/Insights

The electronic components market is analyzed and market size information is provided by the country, components type, commodities type, product type, and end use type as referenced above.

The countries covered in the market report are the U.S., Canada, Mexico, Germany, France, U.K., Italy, Spain, Switzerland, Netherlands, Russia, Turkey, Belgium, rest of Europe, Japan, China, South Korea, India, Australia, Singapore, Thailand, Malaysia, Indonesia, Philippines, rest of Asia-Pacific, South Africa, Israel, U.A.E., Saudi Arabia, Egypt, rest of Middle East and Africa, Brazil, Argentina, Colombia, Peru, Chile, Venezuala, Ecuador and rest of South America.

Asia pacific is expected to be dominate in forecast period due to its robust manufacturing ecosystem, technological expertise, and the presence of key industry players, fostering innovation, efficiency, and cost-effectiveness. Europe is expected to be the fastest growing region in the market due to rapid growth of the electronic components market which can be attributed to the region's strong focus on technological innovation, robust manufacturing capabilities, and increasing demand for advanced electronic devices across various industries.

The country section of the report also provides individual market impacting factors and changes in regulation in the market domestically that impacts the current and future trends of the market. Data points such as new sales, replacement sales, country demographics, regulatory acts and import-export tariffs are some of the major pointers used to forecast the market scenario for individual countries. Also, presence and availability of global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of sales channels are considered while providing forecast analysis of the country data.

Global Electronic Components Market Competitive Landscape and Market Share Analysis

The electronic components market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, production sites and facilities, company strengths and weaknesses, product launch, product trials pipelines, product approvals, patents, product width and breadth, application dominance, technology lifeline curve. The above data points provided are only related to the company’s focus related to electronic components market

Some of the major players operating in the electronic components market are:

• Infineon Technologies AG (Germany)
• NXP Semiconductors NV (Netherlands)
• Texas Instruments, Inc. (U.S.)
• Toshiba Corp. (Japan)
• Intel Corporation (U.S.)
• Maxim Integrated (U.S.)
• Broadcom Inc. (U.S.)
• Qualcomm Inc. (U.S.)
• Analog Devices, Inc. (U.S.)
• Advanced Micro Devices (U.S.)
• Microchip Technology, Inc. (U.S.)
• Monolithic Power Systems, Inc. (U.S.)
• Samsung Semiconductor, Inc. (South Korea)
• SK Hynix Inc. (South Korea)
• Mediatek Inc. (Taiwan)
• Hitachi Ltd. (Japan)
• Schurter (S) Pte, Ltd. (Switzerland)
• Rewell Industrial Co. Ltd. (Taiwan)
• Kyocera Electronics Devices (Japan)
• Watts Electronics Pvt. Ltd. (India)

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Electronic Components Market

Electronic components market size, share & trends analysis report by type (passive, active, electro mechanic), by application (automotive, communication, computing application, industrial, others) and by region(north america, europe, apac, middle east and africa, latam) forecasts, 2023-2031.

Market Dynamics

Regional analysis, report scope, segmental analysis.

• Recent Development

Top Key Players

• Report Overview
• Table of Content
• Segmentation

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Market overview.

The global electronic components market size was valued at USD 186.38 billion in 2022 . It is projected to reach USD 328.50 billion by 2031 , growing at a CAGR of 6.5% during the forecast period (2023-2031).

An electronic component is any simple discrete device used to influence electrons or related fields in an electronic system, assisting in circuit operation. A variety of electrical terminals have computer parts. Further, to create an electronic circuit, these terminals link to other electrical components. Electronic circuit guides and regulates the electric current, including signal amplification, computation, and data transfer, to perform different functions. It contains various elements, including resistors, transistors, condensers, inductors, and diodes.

Growth of IoT and IIoT

With the amplification of advanced technologies and the effective usage of internet networks in manufacturing, there has been a boom in the IoT industry and IoT applications. The infrastructure of the Internet of Things is undergoing major advances. As reported in the Mobile Economy 2020, released by the GSM Association, the number of devices connecting to the Internet—i.e., IoT connections are estimated to hit 25 billion in 2025, from 12 billion in 2019. In a few years, the greater involvement of IoT devices will gradually connect computers to software and link users to essential resources, streamline the corporate workflow, and benefit people. Furthermore, the accelerated penetration of the Internet and mobile devices has contributed to the rise of Industry 4.0, also known as Industrial IoT. As reported in the UN Industrial Development Organization's 'Industry 4.0 Opportunities Behind the Challenge – Background Paper’, Industry 4.0 is a paradigm change from centralized to localized smart manufacturing and production. As a result, the rise of Industry 4.0 and IoT products has led to an improvement in the use of electronic parts, thus improving market growth.

Failure of Electronic Components

Electronic components have a wide variety of modes of failure, such as excess temperature, excess current or voltage, ionizing radiation, mechanical shock, stress or effects, and many other factors that can be responsible for failures. Problems in the product packaging can cause failures in semiconductor devices due to corrosion, device mechanical tension, or open or short circuits.

Some of the common failures are packaging failures, contact failures, printed circuit board failures, relay failures, semiconductor failures, passive element failures, and MEMS failures. The recurring failures are a cause for concern, thereby restraining the growth of the market.

Asia-Pacific

Asia-Pacific is accounted for the maximum share in the global electronic components market due to the presence of favorable technical infrastructure in countries, such as Japan, South Korea, and China. Cost-effective manufacturing and the presence of a large amount of inexpensive labor in China and India has bolstered the growth of the market. As of 2020, the Asia-Pacific region encompasses approximately 61.7% of the total world population, thus holding a major share in the global trade and an impact on the shipments and the adoption of consumer electronic goods.

As stated in a report entitled Asia-Pacific Trade and Investment Trends 2019-2020, published by the United Nations Economic and Social Commission for Asia and the Pacific (UNESCAP), the global trade percentage of the region was accounted for 35% in the year 2018-2019. China is considered the dominant region in the electronic components market due to its supremacy in the manufacturing industry.

North America

North America is anticipated to display massive growth in the electronic components market over the forecast year owing to the massive technical infrastructure and the higher adoption of new technology. Additionally, higher deployment of the latest electronic components has been observed in this region due to the presence of many tech giants and other companies. The U.S. caters to the largest share of the electronic components market in the region. The high technological adoption, suitable technical infrastructure, the deployment of 5G network infrastructure, the tremendous penetration of IoT and other connected devices, and a larger utilization of consumer goods.

Additionally, as stated by eMarketer, there are approximately 98.4% or 8.16 million smartphone users, along with 99% internet users in Canada. The massive adoption of the latest technology has bolstered the need for efficient and faster network speed. Additionally, the NAFTA agreement (North America Free Trade Agreement) has strengthened the trade relationship between the United States, Mexico, and Canada, further driving the adoption of electronic components.

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Based on type, the electronic components market is divided into active, passive, and electro-mechanic. The active components cater to the largest share, followed by the passive components. Active electronic components are the integral components of telecommunications systems and other networking instruments that require an energy supply for the given mission to be carried out. Each electronic circuit typically consists of one active electronic part.

Transistors, diodes, triodes, optoelectronic modules, photoelectric tubes, and integrated circuits are some of the active electronic components. Because of its vast number of applications, such as electronic cameras, microphones, laptops, among many others, integrated circuits are quite in demand active electronic part. Besides, it has been the most profitable of a large range of technical advances in integrated circuits, such as modular IC and multi-layered IC.

By Application

On the basis of application, the Electronic Components market is divided into Automotive, Communication, Computing applications, Industrial, and Others.

The automotive sector caters to the largest share owing to its high dependence on the passive components. Further, Modern Electric Vehicles, Hybrid Electric Vehicles, and Plug-in Hybrid Electric Vehicles need electronic components more than ever before in the control electronics, driving the need for passive components. With the high requirement, manufacturers and suppliers are striving to keep up with the accelerating pace of technological advances.

Further, as reported by the International Energy Agency, the global number of car purchases has steadily risen from 59 million to 93 million over the decade 2010-2019. As per Organisation Internationale des Constructeurs d'Automobiles (OICA), more than 95 million cars were delivered on the world market in 2018. It is anticipated that global vehicle sales will reach the 100 million mark by the end of 2020. Therefore, the tremendous growth in the automotive sector is forecasted to propel the growth of the market.

Market Size By Type

Recent developments.

• In 2019, Eaton acquired Innovative Switchgear Solutions, a specialty manufacturer of medium-voltage electrical equipment serving the North American utility, commercial and industrial markets. The acquisition was aimed to complement the former company's product portfolio of medium-voltage switchgear solutions.
• In 2019, Eaton completes the acquisition of a controlling interest in Ulusoy Elektrik. The acquisition aims at expanding its IEC offerings in EMEA.

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